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Effect of programming biases on the reliability of CHE and CHISEL flash EEPROMs

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dc.contributor.author Rao, V. Ramgopal
dc.date.accessioned 2023-11-06T09:48:58Z
dc.date.available 2023-11-06T09:48:58Z
dc.date.issued 2003
dc.identifier.uri https://ieeexplore.ieee.org/document/1197802
dc.identifier.uri http://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12874
dc.description.abstract The effect of programming biases on the cycling endurance of NOR flash EEPROMs is studied under CHE and CHISEL operation. CHE degradation increases at higher control gate bias (V/sub CG/) and is insensitive to changes in drain bias (V/sub D/) CHISEL degradation is insensitive to changes in both V/sub CG/, and V/sub D/. Furthermore, CHISEL always shows lower degradation when compared to CHE under identical bias and similar programming time. The possible physical mechanisms responsible for the above behavior are clarified by using full band Monte-Carlo simulations. en_US
dc.language.iso en en_US
dc.publisher IEEE en_US
dc.subject EEE en_US
dc.subject Channel hot electron injection en_US
dc.subject EPROM en_US
dc.subject Degradation en_US
dc.subject Nonvolatile memory en_US
dc.subject Integrated circuit reliability en_US
dc.subject Energy Consumption en_US
dc.subject Threshold voltage en_US
dc.title Effect of programming biases on the reliability of CHE and CHISEL flash EEPROMs en_US
dc.type Article en_US


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