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Reliability studies on sub 100 nm SOI-MNSFETs

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dc.contributor.author Rao, V. Ramgopal
dc.date.accessioned 2023-11-07T09:34:46Z
dc.date.available 2023-11-07T09:34:46Z
dc.date.issued 2000
dc.identifier.uri https://ieeexplore.ieee.org/document/911895
dc.identifier.uri http://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12898
dc.description.abstract SOI MNSFETs with channel lengths down to 100 nm and having a Jet Vapor Deposited (JVD) silicon nitride (Si/sub 3/N/sub 4/) gate dielectric are fabricated and characterized. The JVD MNSFETs show comparable performance in comparison to conventional SiO/sub 2/ SOI-MOSFETs, in terms of low gate leakage, Si/sub 3/N/sub 4//Si interface quality and I/sub on//I/sub off/ ratio. In addition, the MNSFETs show better hot carrier reliability compared to conventional MOSFETs. Our results explore the worthiness of JVD Si/sub 3/N/sub 4/ as gate dielectric for future low power ULSI applications. en_US
dc.language.iso en en_US
dc.publisher IEEE en_US
dc.subject EEE en_US
dc.subject MOSFETs en_US
dc.subject Gate leakage en_US
dc.subject Hot carriers en_US
dc.subject Transconductance en_US
dc.subject Thickness measurement en_US
dc.subject Silicon en_US
dc.title Reliability studies on sub 100 nm SOI-MNSFETs en_US
dc.type Article en_US


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