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A molecular dynamics simulation of wear mechanism of diamond tool in nanoscale cutting of copper beryllium

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dc.contributor.author Sharma, Anuj
dc.date.accessioned 2023-11-09T04:07:43Z
dc.date.available 2023-11-09T04:07:43Z
dc.date.issued 2019-01
dc.identifier.uri https://link.springer.com/article/10.1007/s00170-018-03246-0
dc.identifier.uri http://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12941
dc.description.abstract In the present study, molecular dynamics simulation (MDS) is employed to study the wear mechanism of single crystal diamond tool during nanocutting of copper beryllium (CuBe). Two edge configurations, i.e., both sharp and worn out tools, are chosen to study the tool and workpiece interaction during the nanocutting of CuBe. Further, the study involves the experimental characterization techniques viz. scanning electron microscopy (SEM), energy-dispersive X-ray spectroscopy (EDS), and Raman spectroscopy to confirm the simulation results. The results of the molecular dynamics simulation (MDS) show that the presence of Be as a hard particle in workpiece material influences the cutting forces which subsequently causes degradation of the sharp edge of the diamond tool. Furthermore, the carbon (C) atoms removed from the tool react with Be particles and as a result, it causes the formation of beryllium carbide (BeC). Beryllium interaction with the blunt edge configuration of the tool causes amorphization at the tool edge. Raman spectroscopy of the used diamond tool on CuBe reveals the similar phenomena of amorphization of the diamond at the tool edge. Moreover, surface generation is dependent on the tool edge condition as blunt edge tool leads to smoother surface compared to the surface generated by sharp edge configuration. en_US
dc.language.iso en en_US
dc.publisher Springer en_US
dc.subject Mechanical Engineering en_US
dc.subject Molecular dynamics en_US
dc.subject Copper beryllium en_US
dc.subject Molecular dynamics simulation (MDS) en_US
dc.title A molecular dynamics simulation of wear mechanism of diamond tool in nanoscale cutting of copper beryllium en_US
dc.type Article en_US


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