Abstract:
Impurities and inhomogeneity in the metallic materials change the material deformation and removal mechanisms drastically based
upon the impurity content in them. Even a small percentage of Be (0.5-2%) addition in Cu alters the mechanism involved in the cutting
process significantly. Since it becomes experimentally difficult to observe the mechanisms involved in the nanocutting process due
to its length scale, molecular dynamics simulation provides deep insights during cutting process considering the discrete effects of
material. Therefore in this study molecular dynamic simulation (MDS) of cutting operation was performed on Cu and CuBe assuming
Cu as single crystal in both the cases. Results show that Be particle in Cu affects the material deformation and cutting forces
significantly. It is observed that dislocation flow is obstructed by the particle and tool shows wear at the cutting edge in the form of
chipping.