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Path Loss Modeling for RIS-Assisted Wireless System with Direct Link and Elevation Factors

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dc.contributor.author Zafaruddin, S.M.
dc.date.accessioned 2025-01-02T04:43:24Z
dc.date.available 2025-01-02T04:43:24Z
dc.date.issued 2024-02
dc.identifier.uri https://arxiv.org/abs/2402.10419
dc.identifier.uri http://dspace.bits-pilani.ac.in:8080/jspui/handle/123456789/16670
dc.description.abstract The present path loss models for wireless systems employing reconfigurable intelligent surfaces (RIS) do not account for the elevation of the transmitter, receiver, and RIS module. In this paper, we develop an analytical model for path loss of a wireless system utilizing an NxM-element RIS module positioned above the ground surface with elevated transmitter and receiver configurations. Furthermore, we integrate the direct link into the path loss model to enhance its applicability, a crucial aspect often neglected in previous research. We also present simplified analytical expressions for path loss under various configurations, including near-field and far-field scenarios. These expressions elucidate the impact of elevation factors on path loss, facilitating more accurate signal quality estimation at the receiver. Simulation results corroborate that accounting for elevated RIS modules and transceiver units can yield improved deployment strategies for RIS-based wireless systems. en_US
dc.language.iso en en_US
dc.subject EEE en_US
dc.subject Reconfigurable intelligent surfaces (RIS) en_US
dc.subject NxM-element en_US
dc.subject THz wireless systems en_US
dc.title Path Loss Modeling for RIS-Assisted Wireless System with Direct Link and Elevation Factors en_US
dc.type Preprint en_US


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