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Flexible Silicon: Status, Opportunities, and Challenges

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dc.contributor.author Gupta, Navneet
dc.date.accessioned 2025-01-08T11:20:05Z
dc.date.available 2025-01-08T11:20:05Z
dc.date.issued 2024-09
dc.identifier.uri https://ieeexplore.ieee.org/abstract/document/10663398
dc.identifier.uri http://dspace.bits-pilani.ac.in:8080/jspui/handle/123456789/16755
dc.description.abstract The rise of the Internet of Everything has spurred the need for flexible and stretchable electronic devices, particularly in biomedical applications. Monocrystalline silicon, a key material in the semiconductor industry, must be adapted to meet these demands. This article explores various thinning techniques to fabricate flexible silicon wafers, methods for transferring silicon to flexible substrates, and the importance of enhancing silicon’s stretchability. Furthermore, it discusses the impact of flexible silicon on sectors such as biomedical sensing, electronics, and power systems, highlighting the role of the Internet of Things (IoT) platform in interconnecting devices. Finally, the article examines current progress and future prospects in flexible silicon technology, paving the way for further advancements in this rapidly evolving field. en_US
dc.language.iso en en_US
dc.publisher IEEE en_US
dc.subject EEE en_US
dc.subject Flexible Electronics en_US
dc.subject Flexible silicon en_US
dc.subject Ultra-thin chips fabrication en_US
dc.subject Progression en_US
dc.title Flexible Silicon: Status, Opportunities, and Challenges en_US
dc.type Article en_US


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