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Envelope retrofits for enhancing thermal comfort in Indian residences against the backdrop of global warming
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| dc.contributor.author | Ukey, Rahul | |
| dc.date.accessioned | 2025-01-10T09:38:14Z | |
| dc.date.available | 2025-01-10T09:38:14Z | |
| dc.date.issued | 2023 | |
| dc.identifier.uri | http://dspace.bits-pilani.ac.in:8080/jspui/handle/123456789/16761 | |
| dc.description | Under the Supervision of Dr. Aakash Chand Rai and Prof. Shyam Sunder Yadav | en_US |
| dc.language.iso | en | en_US |
| dc.publisher | BITS PILANI, Pilani campus | en_US |
| dc.subject | Mechanical engineering | en_US |
| dc.subject | Envelope retrofit | en_US |
| dc.subject | Thermal comfort | en_US |
| dc.title | Envelope retrofits for enhancing thermal comfort in Indian residences against the backdrop of global warming | en_US |
| dc.type | Thesis | en_US |
