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Multiscale modelling of thermally stressed superelastic polyimide

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dc.contributor.author Islam, Md Rushdie Ibne
dc.date.accessioned 2025-08-07T07:13:13Z
dc.date.available 2025-08-07T07:13:13Z
dc.date.issued 2025-04
dc.identifier.uri https://arxiv.org/abs/2504.20123
dc.identifier.uri http://dspace.bits-pilani.ac.in:8080/jspui/handle/123456789/19143
dc.description.abstract Many thermo-mechanical processes, such as thermal expansion and stress relaxation, originate at the atomistic scale. We develop a sequential multiscale approach to study thermally stressed superelastic polyimide to explore these effects. The continuum-scale smoothed particle hydrodynamics (SPH) model is coupled with atomistic molecular dynamics (MD) through constitutive modelling, where thermo-mechanical properties and equations of state are derived from MD simulations. The results are verified through benchmark problems of heat transfer. Finally, we analyse the insulating capabilities of superelastic polyimide by simulating the thermal response of an aluminium plate. The result shows a considerable reduction in the thermal stress, strain and temperature field development in the aluminium plate when superelastic polyimide is used as an insulator. The present work demonstrates the effectiveness of the multi-scale method in capturing thermo-mechanical interactions in superelastic polyimide. en_US
dc.language.iso en en_US
dc.subject Civil engineering en_US
dc.subject Thermo-mechanical processes en_US
dc.subject Superelastic polyimide en_US
dc.subject Multiscale modelling en_US
dc.subject Molecular dynamics (MD) en_US
dc.title Multiscale modelling of thermally stressed superelastic polyimide en_US
dc.type Preprint en_US


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