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Numerical simulation study on microwave joining of Hastelloy C-276 plates using Inconel-718 interface powder

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dc.contributor.author Mishra, Radha Raman
dc.date.accessioned 2025-10-11T05:00:25Z
dc.date.available 2025-10-11T05:00:25Z
dc.date.issued 2024
dc.identifier.uri https://www.sciencedirect.com/science/article/pii/S2214785323050101
dc.identifier.uri http://dspace.bits-pilani.ac.in:8080/jspui/handle/123456789/19738
dc.description.abstract Microwave joining is an emerging technique for the joining of metallic materials because it can join metals faster and offers uniform heating. The current work studies the multi-physics simulation of a microwave-joined Hastelloy C-276 plate with Inconel 718 interface powder inside a multimode microwave applicator at 2.45 GHz and 900 W. The distribution of electric field, temperature, and thermal stress in the joint were analyzed to understand the microwave-joined Hastelloy C-276 plates. The results revealed that the maximum values of electric field strength and temperature at the central plane of symmetry were 7.4 × 104 V/m and 1.43 × 103 ⁰C, respectively. The maximum thermal stress (1.37 × 109N/m2) was estimated using von-Mises criterion. Resistive losses were found to be maximum i.e., 2.72 × 108 W/m3 at the ends of the graphite plate. The study determined the optimum parameters for microwave joining of Hastelloy C-276 plates. en_US
dc.language.iso en en_US
dc.publisher Elsevier en_US
dc.subject Mechanical engineering en_US
dc.subject Microwave joining en_US
dc.subject Hastelloy C-276 en_US
dc.subject Inconel 718 en_US
dc.subject Electric field distribution en_US
dc.subject Temperature distribution en_US
dc.title Numerical simulation study on microwave joining of Hastelloy C-276 plates using Inconel-718 interface powder en_US
dc.type Article en_US


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