| dc.contributor.author |
Mishra, Radha Raman |
|
| dc.date.accessioned |
2025-10-11T05:00:25Z |
|
| dc.date.available |
2025-10-11T05:00:25Z |
|
| dc.date.issued |
2024 |
|
| dc.identifier.uri |
https://www.sciencedirect.com/science/article/pii/S2214785323050101 |
|
| dc.identifier.uri |
http://dspace.bits-pilani.ac.in:8080/jspui/handle/123456789/19738 |
|
| dc.description.abstract |
Microwave joining is an emerging technique for the joining of metallic materials because it can join metals faster and offers uniform heating. The current work studies the multi-physics simulation of a microwave-joined Hastelloy C-276 plate with Inconel 718 interface powder inside a multimode microwave applicator at 2.45 GHz and 900 W. The distribution of electric field, temperature, and thermal stress in the joint were analyzed to understand the microwave-joined Hastelloy C-276 plates. The results revealed that the maximum values of electric field strength and temperature at the central plane of symmetry were 7.4 × 104 V/m and 1.43 × 103 ⁰C, respectively. The maximum thermal stress (1.37 × 109N/m2) was estimated using von-Mises criterion. Resistive losses were found to be maximum i.e., 2.72 × 108 W/m3 at the ends of the graphite plate. The study determined the optimum parameters for microwave joining of Hastelloy C-276 plates. |
en_US |
| dc.language.iso |
en |
en_US |
| dc.publisher |
Elsevier |
en_US |
| dc.subject |
Mechanical engineering |
en_US |
| dc.subject |
Microwave joining |
en_US |
| dc.subject |
Hastelloy C-276 |
en_US |
| dc.subject |
Inconel 718 |
en_US |
| dc.subject |
Electric field distribution |
en_US |
| dc.subject |
Temperature distribution |
en_US |
| dc.title |
Numerical simulation study on microwave joining of Hastelloy C-276 plates using Inconel-718 interface powder |
en_US |
| dc.type |
Article |
en_US |