Boiling of R134a in a Plate-Fin Heat Exchanger Having Offset Fins

dc.contributor.authorRanganayakulu, Chennu
dc.date.accessioned2023-11-09T10:12:10Z
dc.date.available2023-11-09T10:12:10Z
dc.date.issued2015-12
dc.description.abstractThis paper presents experimental results on boiling heat transfer of R134a in a compact plate fin heat exchanger. The exchanger is made of aluminum and has high density offset fins (30 fins/in.). Such heat exchangers are widely used in air separation industry and aerospace applications because of their high compactness and low weight. The test heat exchanger is attached to a vapor cycle refrigeration basic module to study the effects of boiling phenomena and its influence on performance as there is limited information available for this type of fins. This in turn allows for discussion on boiling mechanism of R134a inside the fins using the water circuit on the other side of the test heat exchanger. The water side single phase heat transfer coefficient (Colburn j factor) is calculated using the cfd tool fluent and validated with available open literature. The results are presented for heat fluxes up to 5500 W/m2 and mass fluxes up to 20 kg/(m2s) with water side flow rate varying from 0.033 to 0.17 kg/s for water temperatures of 10, 15, 20, 25, and 30 °C.en_US
dc.identifier.urihttps://asmedigitalcollection.asme.org/heattransfer/article-abstract/137/12/121002/383739/Boiling-of-R134a-in-a-Plate-Fin-Heat-Exchanger?redirectedFrom=fulltext
dc.identifier.urihttp://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12966
dc.language.isoenen_US
dc.publisherASMEen_US
dc.subjectMechanical Engineeringen_US
dc.subjectHeat exchangeren_US
dc.subjectEvaporationen_US
dc.subjectHeat transfer enhancementen_US
dc.subjectTwo-phase flowen_US
dc.subjectBoilingen_US
dc.titleBoiling of R134a in a Plate-Fin Heat Exchanger Having Offset Finsen_US
dc.typeArticleen_US

Files

License bundle

Now showing 1 - 1 of 1
No Thumbnail Available
Name:
license.txt
Size:
1.71 KB
Format:
Item-specific license agreed upon to submission
Description: