High strain rate dynamic compressive behaviour of Al6061-T6 alloys

dc.contributor.authorGupta, Raj Kumar
dc.date.accessioned2024-02-21T10:56:52Z
dc.date.available2024-02-21T10:56:52Z
dc.date.issued2017-05
dc.description.abstractThis paper investigated the compression behaviour of Al 6061-T6 alloys at various high strain rates through split Hopkinson pressure bar (SHPB) experiments. The compressive strength (σc) of Al 6061-T6 alloy was measured in the present work as a function of high strain rate . The measurements were done in the strain rate regime of 3 × 103 to 6.5 × 103 s− 1. The results showed that the corresponding (σc) increased exponentially with increase in (). But, the increase in strain with increasing was primarily linear. The work hardening coefficient decreased with the increase of strain. However, the decrease of work hardening coefficient with increasing strain rate did not follow a similar trend. With the increase of the strain rate sensitivity increased. As expected, the thermal activation volume decreased with increase in . Using the Zerilli-Armstrong equation attempt was made to evaluate the related material constants to predict the stress-strain curves. The predicted stress-strain behaviours matched reasonably well with those measured experimentally in the current SHPB experiments. The implication of these results in engineering design and simulation in the context of resisting high strain rate impact was also discussed.en_US
dc.identifier.urihttps://www.sciencedirect.com/science/article/pii/S104458031631419X
dc.identifier.urihttp://dspace.bits-pilani.ac.in:8080/jspui/xmlui/handle/123456789/14407
dc.language.isoenen_US
dc.publisherElsevieren_US
dc.subjectPhysicsen_US
dc.subjectStrain Rateen_US
dc.subjectStrain rate sensitivityen_US
dc.subjectDeformationen_US
dc.subjectSHPBen_US
dc.titleHigh strain rate dynamic compressive behaviour of Al6061-T6 alloysen_US
dc.typeArticleen_US

Files

License bundle

Now showing 1 - 1 of 1
No Thumbnail Available
Name:
license.txt
Size:
1.71 KB
Format:
Item-specific license agreed upon to submission
Description: