High Field Stressing Effects in JVD Nitride Capacitors

Abstract

The performance of Jet Vapour Deposited (JVD) Silicon Nitride devices under high field stressing is reported in this paper. Border traps were generated when n-substrate capacitors were stressed with negative gate voltages. Also, an increase in bulk positive charges as well as interface trap density was observed. These results indicate that stressing under negative gate voltages may cause long term reliability problems in Metal-Nitride-Semiconductor (MNS) devices'. Stressing with positive gate voltage, however, does not show any significant degradation.