A High Spatial Resolution Surface Electromyography (sEMG) System Using Fan-Out Wafer-Level Packaging on FlexTrate™

Abstract

We demonstrate a fully integrated wireless surface electromyography (sEMG) system using Fan-Out Wafer-Level Packaging on a flexible biocompatible package with two corrugated high conductivity electroplated Cu wiring levels for efficient routing. The assembly has reliable performance under repeated flexing of >3000 times. The advanced Au capped Cu-based sensing electrode array architecture provides a high spatial resolution sEMG measurement with SNR comparable to standard Ag/AgCl electrodes, allowing for muscle activation signals to be recorded and transmitted wirelessly for off-line post processing. The system, which is compatible with our wireless charging system has a small form factor of 65 mm x 40 mm x 1 mm and light weight of <; 5 gm, making sEMG widely available outside the hospital setting.