Studying Crosstalk Trends for Signal Integrity on Interconnects using Finite Element Modeling

Abstract

In high-speed digital design, strong electromagnetic coupling exists between adjacent transmission lines. This manifests itself in the form of crosstalk voltage induced on either line. Crosstalk is modeled in terms of capacitance and inductance matrices which are extracted using COMSOL Multiphysics®. Further, trends of crosstalk are observed with variations in dielectric constant of substrate, its height, pitch ratio and different grounding arrangements. Finally, ideas to keep crosstalk to a minimum are proposed.