A Novel TCAD based Thermal Extraction Approach for Nano-scale FinFETs
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Date
2017-02
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Publisher
IEEE
Abstract
Self-heating and thermal modeling in fin-shaped FETs (FinFETs) are studied in this brief using calibrated 3-D TCAD simulations. Using the second order R th C th network extraction, we demonstrate for the first time a simple method for the modeling of thermal resistances and capacitances for BSIMCMG compact models using small-signal ac capacitance method. We show that the extraction of thermal time constants using the second-order R th C th method is superior to the other techniques used in the literature. Using this technique, we extract the thermal time constants for FinFETs to be in the order of a few nano/pico seconds.
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Keywords
EEE, Fin-shaped FET (FinFET), Self-heating effects (SHEs), Silicon on insulator (SOI)