Department of Mechanical engineering

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Now showing 1 - 7 of 7
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    Influence of Slotting and Boss Radius on the Response of MEMS Based Intracranial Pressure Sensor
    (UPI Journals, 2018) Rao, Venkatesh K.P.
    In the present paper, we design a Microelectro- Mechanical System (MEMS) piezoresistive pressure sensor for intracranial pressure monitoring. The pressure sensor design presented in this paper consists of a square diaphragm. The slots were introduced to square diaphragm increases the stresses developed thus enhancing the sensitivity of the sensor In addition to slots, a central boss was introduced to enhance the sensitivity of the sensor. We carried out numerical simulation to evaluate the sensitivity of the sensor. Parametric studies were done to optimize the central boss radius to enhance the sensitivity of the sensor.
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    Effect of external electric potential on the mechanical resonance of MEMS cantilever resonator
    (IOP, 2022-08) Rao, Venkatesh K.P.
    This work presents an analytical model to predict the natural frequency of electrostatically actuated micromachined cantilever beam under the application of DC voltage. The analytical modelling uses an energy based method with a sinusoidal vibration assumption. The electric field between the cantilever electrodes is assumed to be vertical and fringing field effects are neglected. The behaviour of natural frequency and a closed-form expression for pull-in voltage are evaluated. The electrostatic spring softening effect of DC bias on the resonant natural frequency is studied in particular. Results are compared with simulation in ANSYS.
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    Design and Analysis of Single Drive Tri-Axis MEMS Gyroscope
    (Springer, 2022-11) Rao, Venkatesh K.P.
    MEMS based single and dual-axis gyroscopes have been widely explored for potential application in automotive, space, defense, and consumer electronics sectors. Tri-axis gyroscopes based on MEMS, however, have been sparsely studied. This work presents a novel design for tri-axis MEMS gyroscope and an analytical model to obtain the natural frequencies in drive and sense modes. These frequency values have been compared with the numerically obtained frequencies using Finite Element Analysis (FEA). The analytical results lie within 10% of their numerically obtained values. The frequency matching process involves many iterations of geometric dimensions if the end application requires minor design changes. The proposed analytical model will make the design customization easy as the frequencies of each mode will be expressed as a function of critical geometrical parameters saving multiple numerical runs required for design optimization.
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    System integration design in MEMS — A case study of micromachined load cell
    (Springer, 2009-10) Rao, Venkatesh K.P.
    One of the critical issues in large scale commercial exploitation of MEMS technology is its system integration. In MEMS, a system design approach requires integration of varied and disparate subsystems with one of a kind interface. The physical scales as well as the magnitude of signals of various subsystems vary widely. Known and proven integration techniques often lead to considerable loss in advantages the tiny MEMS sensors have to offer. Therefore, it becomes imperative to think of the entire system at the outset, at least in terms of the concept design. Such design entails various aspects of the system ranging from selection of material, transduction mechanism, structural configuration, interface electronics, and packaging. One way of handling this problem is the system-in-package approach that uses optimized technology for each function using the concurrent hybrid engineering approach. The main strength of this design approach is the fast time to prototype development. In the present work, we pursue this approach for a MEMS load cell to complete the process of system integration for high capacity load sensing. The system includes; a micromachined sensing gauge, interface electronics and a packaging module representing a system-in-package ready for end characterization. The various subsystems are presented in a modular stacked form using hybrid technologies. The micromachined sensing subsystem works on principles of piezo-resistive sensing and is fabricated using CMOS compatible processes. The structural configuration of the sensing layer is designed to reduce the offset, temperature drift, and residual stress effects of the piezo-resistive sensor. ANSYS simulations are carried out to study the effect of substrate coupling on sensor structure and its sensitivity. The load cell system has built-in electronics for signal conditioning, processing, and communication, taking into consideration the issues associated with resolution of minimum detectable signal. The packaged system represents a compact and low cost solution for high capacity load sensing in the category of compressive type load sensor.
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    Design and characterization of in-plane MEMS yaw rate sensor
    (Springer, 2009-10) Rao, Venkatesh K.P.
    In this paper, we present the design and characterization of a vibratory yaw rate MEMS sensor that uses in-plane motion for both actuation and sensing. The design criterion for the rate sensor is based on a high sensitivity and low bandwidth. The required sensitivity of the yawrate sensor is attained by using the inplane motion in which the dominant damping mechanism is the fluid loss due to slide film damping i.e. two–three orders of magnitude less than the squeeze-film damping in other rate sensors with out-of-plane motion. The low bandwidth is achieved by matching the drive and the sense mode frequencies. Based on these factors, the yaw rate sensor is designed and finally realized using surface micromachining. The inplane motion of the sensor is experimentally characterized to determine the sense and the drive mode frequencies, and corresponding damping ratios. It is found that the experimental results match well with the numerical and the analytical models with less than 5% error in frequencies measurements. The measured quality factor of the sensor is approximately 467, which is two orders of magnitude higher than that for a similar rate sensor with out-of-plane sense direction.
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    Fabrication, characterization and comparative analysis of mechanical properties of micro features generated by reverse micro EDM
    (Springer, 2019-07) Roy, Tribeni
    Moderate to high aspect ratio micro features (projected) finds wide application in MEMS components, fuel cells for micro reactors, sensors and actuators, micro optical components etc. Reverse micro electro discharge machining (RMEDM) is one of the extensively used process for fabricating such micro features. The present authors have already developed a technique for generating different shapes and sizes of micro features by suitable modification of tool in RMEDM. Mechanical properties like hardness and elastic modulus of these micro features play a significant role in determining their suitability for various applications. Therefore, the objective of this paper is (a) to generate projected micro features corresponding to tapered blind hole depths of 0.1 mm and 0.3 mm using RMEDM and (b) to determine the effect of tapered blind hole depth on the hardness and elastic modulus of the projected micro features. Hardness and elastic modulus were measured using nano indentation technique. Results indicate that starting from the periphery, both hardness as well as elastic modulus first increase (presence of recast layer) and then decrease (presence of heat affected zone) for projected micro feature corresponding to 0.1 mm hole depth before attaining the properties of the parent material. Due to high amount of debris agglomeration in case of 0.3 mm hole depth, high amount of abnormal discharges occur which do not provide sufficient time for the formation of thermally softened layer as was in the case of micro feature corresponding to 0.1 mm hole depth. Hardness, therefore, is always high starting from recast layer to the HAZ before finally attaining the hardness of the parent material. Debris agglomeration did not have much influence on the elastic modulus and the variation of elastic modulus of the micro feature corresponding to 0.3 mm hole depth remains fairly uniform a compared to the parent material.
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    MEMS Sensors for Automotive Applications: A Review
    (Springer, 2018-11) Bhatt, Geeta
    The automotive industry has always been an area, where the possibility to explore more and to achieve next-gen technology remains a challenge. As the market is growing, the possibilities are being explored on a wider scale. And these growing possibilities are increasingly demanding the research for the more accurate functioning of the automotive through the use of various sensors and the integration aspects associated with them. While enhancing the quality/performance of the vehicle, the need to reduce the size of sensors always remains a challenge. Over the period of time, the technology has advanced and these challenges are taken care through the use of MEMS (Microelectro mechanical systems) integrated systems. MEMS helps in devising microscale sensors with higher accuracy in small size and low cost. In the automotive, there exists a huge need for these installing these sensors and utilizing them to refine the performance characteristics of the vehicles. This chapter aims at discussing important MEMS-based sensors and their applications in the automotive-like tire pressure and monitoring systems, engine management system, vehicle stability/passenger safety system, and emission control.