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    Nanowire Impregnated Poly-dimethyl Siloxane for Flexible, Thermally Conductive Fan-Out Wafer-Level Packaging
    (IEEE, 2020) Benedict, Samatha
    FlexTrate TM , a flexible hybrid electronics (FHE) platform based on fan-out wafer level packaging (FOWLP) has demonstrated low die shift by using room temperature cured poly-dimethyl siloxane (PDMS) as a molding compound. In this paper, we investigate the enhancement of the thermal conductivity in PDMS used in the FlexTrate TM process to allow for better thermal management via microwave welding of commercially available copper nanowires dispersed in an uncured PDMS matrix, followed by a standard curing process. We also evaluate the thermal stability of PDMS, necessary if FlexTrate TM assemblies are to be used in conjunction with commonly used solder reflow processes, and show that PDMS is stable at standard reflow temperatures. Thermal conductivity enhancement using the microwave welding process is shown to be minimal, with a peak enhancement of ~40%.
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    A High Spatial Resolution Surface Electromyography (sEMG) System Using Fan-Out Wafer-Level Packaging on FlexTrate™
    (IEEE, 2020) Benedict, Samatha
    We demonstrate a fully integrated wireless surface electromyography (sEMG) system using Fan-Out Wafer-Level Packaging on a flexible biocompatible package with two corrugated high conductivity electroplated Cu wiring levels for efficient routing. The assembly has reliable performance under repeated flexing of >3000 times. The advanced Au capped Cu-based sensing electrode array architecture provides a high spatial resolution sEMG measurement with SNR comparable to standard Ag/AgCl electrodes, allowing for muscle activation signals to be recorded and transmitted wirelessly for off-line post processing. The system, which is compatible with our wireless charging system has a small form factor of 65 mm x 40 mm x 1 mm and light weight of <; 5 gm, making sEMG widely available outside the hospital setting.
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    Development and Analysis of Graphene Nanoplatelets (GNPs)-Based Flexible Strain Sensor for Health Monitoring Applications
    (IEEE, 2020-11) Gupta, Navneet
    Recently,flexible electronic devices have gained tremendous research interest owing to their wide range of applicationssuch as humanmotion detection, healthmonitoring and electronic skin (E-Skin). Particularly, the development of skin-like flexible strain sensors is gradually increasing for the realization of multipurpose human-machine interfaces. This paper aims to propose a simplemethod ofmanufacturing flexible graphene-based strain sensors with high sensitivity. Herein, a novel flexible resistive-strain sensor based on graphene nanoplatelets (GNP)/PDMS has been reported that providesgood strain sensitivity,stretchabilityup to 65%with a gauge factor of 62.5, indicating typical piezo-resistive characteristics. The fabricated sensor is attached to the human body, it works as a health-monitoring device by detecting various human motions such as human wrist pulse measurement, the finger bendingmovement and in addition to the flexible pipe bending. This work presents fabrication, characterization and comparative study of four different types of GNP wrist pulse sensors. Therefore, with its simple structure and low cost processing coupledwith reasonably good piezo-resistive behavior, it has great potential in wearable electronics, viz. human motion detection and health monitoring applications.