Envelope retrofits for enhancing thermal comfort in Indian residences against the backdrop of global warming
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Date
2023
Authors
Journal Title
Journal ISSN
Volume Title
Publisher
BITS PILANI, Pilani campus
Abstract
Description
Under the Supervision of Dr. Aakash Chand Rai and Prof. Shyam Sunder Yadav
Keywords
Mechanical engineering, Envelope retrofit, Thermal comfort