Envelope retrofits for enhancing thermal comfort in Indian residences against the backdrop of global warming

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dc.contributor.authorUkey, Rahul
dc.date.accessioned2025-01-10T09:38:14Z
dc.date.available2025-01-10T09:38:14Z
dc.date.issued2023
dc.descriptionUnder the Supervision of Dr. Aakash Chand Rai and Prof. Shyam Sunder Yadaven_US
dc.identifier.urihttp://hdl.handle.net/10603/581532
dc.language.isoenen_US
dc.publisherBITS PILANI, Pilani campusen_US
dc.subjectMechanical engineeringen_US
dc.subjectEnvelope retrofiten_US
dc.subjectThermal comforten_US
dc.titleEnvelope retrofits for enhancing thermal comfort in Indian residences against the backdrop of global warmingen_US
dc.typeThesisen_US

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Department of Mechanical engineering