MD simulation study to investigate nanocutting process in Cu and CuBe

Abstract

Impurities and inhomogeneity in the metallic materials change the material deformation and removal mechanisms drastically based upon the impurity content in them. Even a small percentage of Be (0.5-2%) addition in Cu alters the mechanism involved in the cutting process significantly. Since it becomes experimentally difficult to observe the mechanisms involved in the nanocutting process due to its length scale, molecular dynamics simulation provides deep insights during cutting process considering the discrete effects of material. Therefore in this study molecular dynamic simulation (MDS) of cutting operation was performed on Cu and CuBe assuming Cu as single crystal in both the cases. Results show that Be particle in Cu affects the material deformation and cutting forces significantly. It is observed that dislocation flow is obstructed by the particle and tool shows wear at the cutting edge in the form of chipping.