Department of Electrical and Electronics Engineering
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Item 1/f Noise in Drain and Gate Current of MOSFETs With High-k Gate Stacks Publisher: IEEE PDF(IEEE, 2009-06) Rao, V. RamgopalIn this paper, we investigate the quality of MOSFET gate stacks where high- k materials are implemented as gate dielectrics. We evaluate both drain- and gate-current noises in order to obtain information about the defect content of the gate stack. We analyze how the overall quality of the gate stack depends on the kind of high- k material, on the interfacial layer thickness, on the kind of gate electrode material, on the strain engineering, and on the substrate type. This comprehensive study allows us to understand which issues need to be addressed in order to achieve improved quality of the gate stack from a 1/ f noise point of view.Item Border-Trap Characterization in High-κ Strained-Si MOSFETs(IEEE, 2007-08) Rao, V. RamgopalIn this letter, we focus on the border-trap characterization of TaN/HfO 2 /Si and TaN/HfO 2 /strained-Si/Si 0.8 Ge 0.2 n-channel MOSFET devices. The equivalent oxide thickness for the gate dielectrics is 2 nm. Drain-current hysteresis method is used to characterize the border traps, and it is found that border traps are higher in the case of high-kappa films on strained- Si/Si 0.8 Ge 0.2 .These results are also verified by the 1/f-noise measurements. Possible reasons for the degraded interface quality of high-kappa films on strained-Si are also proposed.