Department of Electrical and Electronics Engineering
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Item Nanowire Impregnated Poly-dimethyl Siloxane for Flexible, Thermally Conductive Fan-Out Wafer-Level Packaging(IEEE, 2020) Benedict, SamathaFlexTrate TM , a flexible hybrid electronics (FHE) platform based on fan-out wafer level packaging (FOWLP) has demonstrated low die shift by using room temperature cured poly-dimethyl siloxane (PDMS) as a molding compound. In this paper, we investigate the enhancement of the thermal conductivity in PDMS used in the FlexTrate TM process to allow for better thermal management via microwave welding of commercially available copper nanowires dispersed in an uncured PDMS matrix, followed by a standard curing process. We also evaluate the thermal stability of PDMS, necessary if FlexTrate TM assemblies are to be used in conjunction with commonly used solder reflow processes, and show that PDMS is stable at standard reflow temperatures. Thermal conductivity enhancement using the microwave welding process is shown to be minimal, with a peak enhancement of ~40%.Item A High Spatial Resolution Surface Electromyography (sEMG) System Using Fan-Out Wafer-Level Packaging on FlexTrate™(IEEE, 2020) Benedict, SamathaWe demonstrate a fully integrated wireless surface electromyography (sEMG) system using Fan-Out Wafer-Level Packaging on a flexible biocompatible package with two corrugated high conductivity electroplated Cu wiring levels for efficient routing. The assembly has reliable performance under repeated flexing of >3000 times. The advanced Au capped Cu-based sensing electrode array architecture provides a high spatial resolution sEMG measurement with SNR comparable to standard Ag/AgCl electrodes, allowing for muscle activation signals to be recorded and transmitted wirelessly for off-line post processing. The system, which is compatible with our wireless charging system has a small form factor of 65 mm x 40 mm x 1 mm and light weight of <; 5 gm, making sEMG widely available outside the hospital setting.